Epoxy/Potting Compounds

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Product Description :

TIM-800 series are thermally conductive, electrically insulating epoxies engineered with highly conductive ceramic fillers and non silicone resins. They are designed for the demanding needs of die-attach heat sink bonding and surface mount applications. Rapid heat transfer properties eliminate hot spots and the low epoxy shrinkage factor minimizes the risk of damage to fragile components, resulting in increased operating efficiencies. Available in one part, two parts, heat curable and room temperature cure systems.

Typical Applications :
Fabricating heat sink, bonding semiconductors, substrate attach, lid seal, SMD attach, stacking components and die attach applications

Most Popular Products :

  • TIM-813: One part heat cure system, excellent conductivity and bond strength at high temperature
  • TIM-818: High strength, thermally conductive adhesive, flash cure in 5 minutes. No mix, two part system to replace mechanical clips, fasteners or tapes in securing heat generating devices and heat sink
  • Property 813 813HTC 816 816HTC 818
    Thermal Conductivity W/mºK
    1.5
    2.7
    0.85
    2.7
    0.8
    Type/Cure
    One Part
    Heat Cure
    One Part
    Heat Cure
    Two Part
    RT Cure
    Two Part
    RT Cure
    Two Part
    No Mix
    Flash cure
    Pot life(100grams)
    ½ hr @ 80°C
    ½ hr @ 80°C
    ½ hr @ 25°C
    ½ hr @ 25°C
    5 minutes
    @ 25°C
    Shelf life
    4 months
    @25ºC
    4 months
    @25ºC
    2 years
    @25ºC
    2 years
    @25ºC
    1 years
    @25Cº
    Dielectric strength, V/Mil
    460
    460
    420
    420
    570
    Max. Service Temperature ºC
    270
    270
    150
    150
    150