Product Description : TIM-GAP is designed to meet industry’s growing need for interface material with high conductivity and greater conformability for easier application. Electrically isolating property allows its use in applications requiring isolations between heat sinks and high voltage, bare leaded devices. Available in Silicone and Non Silicone formulas with thermal conductivity up to 11 W/mºK.

Typical Application : Gap Fillers are used to fill air gaps between components or PC boards and heat sinks, metal enclosures and chasses. Ideal for application where large gap tolerances are present due to steps, rough surfaces, and high stack-up. Gap Filler materials allow the designer to be less concerned with components proximity to heat sinks or heat spreaders.

Most Popular Products :

• TIM-GAP 1102: Cost-effective, maximize heat transfer from electronic components to heat sink or heat spreaders. High thermal conductivity (2.4 W/mºK) with low modulus.
• TIM-GAP 1106: Highly conformable, thermally conductive with electrically insulated. Commonly used in uneven, irregular surfaces to fill air gaps. High thermal conductivity (6W/mºK) with low modulus.
• TIM-GAP ULTRA SOFT: Specially designed for extremely low stress applications, clean, production friendly, lowest modulus type, viscoelastic thermal interface material.
• TIM-GAP NS: Non-Silicone gap filler specially formulated to replace silicone materials due to the silicone oil extraction and contamination. Suitable for aerospace and military applications.